23-60FS-SNPB-24

Производитель-деталь №
23-60FS-SNPB-24
Производитель
Leader Tech Inc.
Упаковка/футляр
-
Техническое описание
23-60FS-SNPB-24
Описание
0.23 X 0.60 SNPB 24--FOLDED SERI
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35000

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lang_0872 :
Leader Tech Inc.
Категория товара :
RF/IF and RFID > RFI and EMI - Contacts, Fingerstock and Gaskets
Attachment Method :
Adhesive
Material :
Beryllium Copper
Operating Temperature :
-55°C ~ 121°C
Plating :
Lead, Tin
Plating - Thickness :
Flash
Product Status :
Active
Shape :
-
Type :
Fingerstock
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23-60FS-SNPB-24

Продукты, связанные с производителем

Продукты, связанные с каталогом

  • TE Connectivity AMP Connectors
    SPRING FINGER 1.2H
  • Harwin
    RFI SHIELD CLIP MINI TIN SMD
  • Harwin
    SMT RFI CLIP 1900/TR (T&R)
  • Harwin
    RFI SHIELD CLIP MICRO TIN SMD
  • TE Connectivity AMP Connectors
    PRE-LOADED SPRING FINGER 2.15MM

Сопутствующие товары

Деталь Производитель Склад Описание
23-6040-0018 Kester 35,000 SOLDER RA FLUX 22AWG 60/40 .5LB
23-6040-0027 Kester 35,000 SOLDER RA FLUX 20AWG 60/40 .5LB
23-60FS-BD-24 Leader Tech Inc. 35,000 0.23 X 0.60 BD 24--FOLDED SERIES
23-60FS-BD-24-NTP Leader Tech Inc. 35,000 0.23 X 0.60 BD 24 NTP--FOLDED SE
23-60FS-BD-3.0 Leader Tech Inc. 35,000 0.23 X 0.60 BD 3--FOLDED SERIES
23-60FS-BD-400 Leader Tech Inc. 35,000 0.23 X 0.60 BD 400--FOLDED SERIE
23-60FS-MAG-24 Leader Tech Inc. 35,000 0.23 X 0.60 MAG 24--FOLDED SERIE
23-60FS-NI-24 Leader Tech Inc. 35,000 0.23 X 0.60 NI 24--FOLDED SERIES
23-60FS-SN-16 Leader Tech Inc. 35,000 0.23 X 0.60 SN 16--FOLDED SERIES
23-60FS-SN-24 Leader Tech Inc. 35,000 0.23 X 0.60 SN 24--FOLDED SERIES
23-60FSV50-BD-24 Leader Tech Inc. 35,000 0.23 X 0.60 BD 24--FOLDED SERIES
23-60FSV50-SN-24 Leader Tech Inc. 35,000 0.23 X 0.60 SN 24--FOLDED SERIES
23-6337-0007 Kester 35,000 SOLDER RA FLUX 27AWG 63/37 .5LB
23-6337-0018 Kester 35,000 SOLDER RA FLUX 22AWG 63/37 .5LB
23-6337-0027 Kester 35,000 SOLDER RA FLUX 20AWG 63/37 .5LB