DIP050-628-157BLF

Производитель-деталь №
DIP050-628-157BLF
Производитель
Amphenol Communications Solutions
Упаковка/футляр
-
Техническое описание
DIP050-628-157BLF
Описание
CONN IC DIP SOCKET 28POS TIN
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35000

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Amphenol Communications Solutions
Категория товара :
Sockets for ICs, Transistors > IC Sockets
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
28 (2 x 14)
Operating Temperature :
-
Product Status :
Obsolete
Termination :
Solder
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DIP050-628-157BLF

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