- Manufacturer :
- Harwin
- Product Category :
- RF/IF and RFID > RFI and EMI - Contacts, Fingerstock and Gaskets
- Attachment Method :
- Solder
- Material :
- Copper Alloy
- Operating Temperature :
- -55°C ~ 125°C
- Plating :
- Gold
- Plating - Thickness :
- Flash
- Product Status :
- Active
- Shape :
- -
- Type :
- Shield Finger, Pre-Loaded
- Datasheets
- S7111-42R
Manufacturer related products
Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| S7110PB-C2 | MaxLinear | 35,000 | PROCESSOR CHIP FBGA |
| S7110PB-C3 | MaxLinear | 35,000 | IC PROCESSOR 1.2V 400FBGA |
| S7110PB-HC2 | MaxLinear | 35,000 | PROCESSOR CHIP FBGA |
| S7110PB-HC3 | MaxLinear | 35,000 | IC PROCESSOR 1.2V 400FBGA |
| S7110PB-HE3 | MaxLinear | 35,000 | IC PROCESSOR 1.2V 400FBGA |
| S7112BX00013 | Panduit Corporation | 35,000 | ENCLOSURE 700MM X 1070MM |
| S7112BX00015 | Panduit Corporation | 35,000 | ENCLOSURE 700MM X 1070MM |
| S711E | Swanstrom Tools | 35,000 | CUTTER |
| S711E20E0VFNE2 | NXP Semiconductors | 35,000 | IC MCU 8BIT 20KB OTP 52PLCC |
| S711E20E0VFNE2R | NXP Semiconductors | 35,000 | IC MCU 8BIT 20KB OTP 52PLCC |
| S711E20E0VFNE2R518 | NXP Semiconductors | 101 | S711E20E0VFNE2R518 |
| S711E20E0VFUE3 | NXP Semiconductors | 117 | 8-BIT MCU, 20K EPROM, 768 RAM |
