A14162-32

Mfr.Part #
A14162-32
Manufacturer
Laird - Performance Materials
Package/Case
-
Datasheet
A14162-32
Description
THERM PAD 228.6MMX228.6MM GRAY
Stock
35000

Request A Quote(RFQ)

* Contact Name:
  Company:
* E-Mail:
  Whatsapp:
  Comment:
Manufacturer :
Laird - Performance Materials
Product Category :
Fans, Thermal Management > Thermal - Pads, Sheets
Adhesive :
Tacky - Both Sides
Backing, Carrier :
-
Color :
Gray
Material :
Silicone Elastomer
Outline :
228.60mm x 228.60mm
Product Status :
Obsolete
Shape :
Square
Thermal Conductivity :
1.5W/m-K
Thermal Resistivity :
-
Type :
Gap Filler Pad, Sheet
Usage :
-
Datasheets
A14162-32

Manufacturer related products

  • Laird - Performance Materials
    BATT CONTACT SOLID 1 CELL SMD
  • Laird - Performance Materials
    CONN EMI GASKET BLUE
  • Laird - Performance Materials
    CONN SHIELDING FOR DB15
  • Laird - Performance Materials
    FILTER BLOCK 9 POS D-SUB
  • Laird - Performance Materials
    FILTER BLOCK 15 POS D-SUB

Catalog related products

Related products

Part Manufacturer Stock Description
A14100A-1BG313C Microsemi 35,000 IC FPGA 228 I/O 313BGA
A14100A-1CQ256B Microsemi 35,000 IC FPGA 228 I/O 256CQFP
A14100A-1CQ256C Microsemi 35,000 IC FPGA 228 I/O 256CQFP
A14100A-1CQ256M Microsemi 35,000 IC FPGA 228 I/O 256CQFP
A14100A-1PG257B Microsemi 35,000 IC FPGA 228 I/O 257CPGA
A14100A-1PG257C Microsemi 35,000 IC FPGA 228 I/O 257CPGA
A14100A-1PG257M Microsemi 35,000 IC FPGA 228 I/O 257CPGA
A14100A-1RQ208C Microsemi 35,000 IC FPGA 175 I/O 208RQFP
A14100A-1RQ208I Microsemi 35,000 IC FPGA 175 I/O 208RQFP
A14100A-BG313C Microsemi 35,000 IC FPGA 228 I/O 313BGA
A14100A-CQ256B Microsemi 35,000 IC FPGA 228 I/O 256CQFP
A14100A-CQ256C Microsemi 35,000 IC FPGA 228 I/O 256CQFP
A14100A-CQ256M Microsemi 35,000 IC FPGA 228 I/O 256CQFP
A14100A-PG257B Microsemi 35,000 IC FPGA 228 I/O 257CPGA
A14100A-PG257C Microsemi 35,000 IC FPGA 228 I/O 257CPGA