303N

Mfr.Part #
303N
Manufacturer
Wakefield Thermal
Package/Case
-
Datasheet
303N
Description
HEATSINK COMPACT
Stock
35000

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Manufacturer :
Wakefield Thermal
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Press Fit
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
Stud Mounted Semiconductor Cases
Power Dissipation @ Temperature Rise :
15.0W @ 37°C
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
1.30°C/W @ 250 LFM
Thermal Resistance @ Natural :
-
Type :
Board Level, Vertical
Datasheets
303N

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303NN Wakefield Thermal 35,000 HEATSINK EXT PWR SEMICOND