HSE08-505028

Mfr.Part #
HSE08-505028
Manufacturer
CUI Devices
Package/Case
-
Datasheet
HSE08-505028
Description
HEAT SINK, EXTRUSION, TO-218/TO-
Stock
1118

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Manufacturer :
CUI Devices
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Clip
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Power Dissipation @ Temperature Rise :
10.53W @ 75°C
Product Status :
Active
Shape :
Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow :
2.70°C/W @ 200 LFM
Thermal Resistance @ Natural :
7.13°C/W
Type :
Board Level
Datasheets
HSE08-505028

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