HSE01-193175

Mfr.Part #
HSE01-193175
Manufacturer
CUI Devices
Package/Case
-
Datasheet
HSE01-193175
Description
HEAT SINK, EXTRUSION, 19 X 31.5
Stock
1577

Request A Quote(RFQ)

* Contact Name:
  Company:
* E-Mail:
  Whatsapp:
  Comment:
Manufacturer :
CUI Devices
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Blue Anodized
Package Cooled :
-
Power Dissipation @ Temperature Rise :
2.95W @ 75°C
Product Status :
Active
Shape :
Square, Angled Fins
Thermal Resistance @ Forced Air Flow :
9.20°C/W @ 200 LFM
Thermal Resistance @ Natural :
25.44°C/W
Type :
Top Mount
Datasheets
HSE01-193175

Manufacturer related products

Catalog related products

Related products

Part Manufacturer Stock Description
HSE01-193175P CUI Devices 1,582 HEAT SINK, EXTRUSION, 19 X 31.5
HSE02-173213 CUI Devices 1,542 HEAT SINK, EXTRUSION, 17 X 31.9
HSE02-173213P CUI Devices 1,572 HEAT SINK, EXTRUSION, 17 X 31.9
HSE04-251265-1 CUI Devices 2,713 HEAT SINK, EXTRUSION, TO-218/TO-
HSE04-251265-2 CUI Devices 2,577 HEAT SINK, EXTRUSION, TO-218/TO-
HSE05-171933 CUI Devices 3,230 HEAT SINK, EXTRUSION, TO-218/TO-
HSE06-503045 CUI Devices 1,197 HEAT SINK, EXTRUSION, TO-218/TO-
HSE07-753045 CUI Devices 992 HEAT SINK, EXTRUSION, TO-218/TO-
HSE08-505028 CUI Devices 1,118 HEAT SINK, EXTRUSION, TO-218/TO-
HSE09-755028 CUI Devices 999 HEAT SINK, EXTRUSION, TO-218/TO-