HSB25-282810

Mfr.Part #
HSB25-282810
Manufacturer
CUI Devices
Package/Case
-
Datasheet
HSB25-282810
Description
HEAT SINK, BGA, 28.5 X 28.5 X 10
Stock
1704

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Manufacturer :
CUI Devices
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Push Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
4.87W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
5.10°C/W @ 200 LFM
Thermal Resistance @ Natural :
15.41°C/W
Type :
Top Mount
Datasheets
HSB25-282810

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