655-53AB

Mfr.Part #
655-53AB
Manufacturer
Wakefield Thermal
Package/Case
-
Datasheet
655-53AB
Description
HEATSINK CPU 40.6MM SQ H=.525"
Stock
6921

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Manufacturer :
Wakefield Thermal
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
4.0W @ 40°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
2.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount
Datasheets
655-53AB

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