HSE-B250-04H

Mfr.Part #
HSE-B250-04H
Manufacturer
CUI Devices
Package/Case
-
Datasheet
HSE-B250-04H
Description
HEAT SINK, EXTRUSION, TO-220, 25
Stock
2208

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Manufacturer :
CUI Devices
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Bolt On and PC Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-220
Power Dissipation @ Temperature Rise :
8.0W @ 75°C
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
3.26°C/W @ 200 LFM
Thermal Resistance @ Natural :
13.60°C/W
Type :
Board Level, Vertical
Datasheets
HSE-B250-04H

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