HSB12-272706

Mfr.Part #
HSB12-272706
Manufacturer
CUI Devices
Package/Case
-
Datasheet
HSB12-272706
Description
HEAT SINK, BGA, 27 X 27 X 6 MM
Stock
1713

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Manufacturer :
CUI Devices
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
3.8W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
7.80°C/W @ 200 LFM
Thermal Resistance @ Natural :
19.59°C/W
Type :
Top Mount
Datasheets
HSB12-272706

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