HSB03-141406

Mfr.Part #
HSB03-141406
Manufacturer
CUI Devices
Package/Case
-
Datasheet
HSB03-141406
Description
HEAT SINK, BGA, 14 X 14 X 6 MM
Stock
3326

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Manufacturer :
CUI Devices
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
2.1W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
15.80°C/W @ 200 LFM
Thermal Resistance @ Natural :
35.98°C/W
Type :
Top Mount
Datasheets
HSB03-141406

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