Images are for reference only.

HSB02-101007

ATS-PCB1074

Advanced Thermal Solutions, Inc.

HEATSINK TO-263 COPPER
ATS-CPX025025015-166-C1-R0

Advanced Thermal Solutions, Inc.

HEATSINK 25X25X15MM R-TAB CP
ATS-CPX025025015-138-C2-R0

Advanced Thermal Solutions, Inc.

HEATSINK 25X25X15MM L-TAB CP
ATS-CPX050050025-124-C2-R0

Advanced Thermal Solutions, Inc.

HEATSINK 50X50X25MM XCUT CP
ATS-TI10P-521-C1-R1

Advanced Thermal Solutions, Inc.

HEAT SINK FOR TI MOD #TPA3130D

Part	Manufacturer	Stock	Description
HSB01-080808	CUI Devices	35,000	HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
HSB0104YP-NTR-E	Intersil (Renesas Electronics Corporation)	6,000	SCHOTTKY BARRIER DIODE
HSB0104YPTL-E	Intersil (Renesas Electronics Corporation)	111,092	SCHOTTKY BARRIER DIODE
HSB0104YPTR-E	Intersil (Renesas Electronics Corporation)	2,571	SCHOTTKY BARRIER DIODE
HSB03-121218	CUI Devices	1,689	HEAT SINK, BGA, 12 X 12 X 18 MM
HSB03-141406	CUI Devices	3,326	HEAT SINK, BGA, 14 X 14 X 6 MM
HSB04-171706	CUI Devices	35,000	HEAT SINK, BGA, 17 X 17 X 6 MM
HSB05-171711	CUI Devices	35,000	HEAT SINK, BGA, 17 X 17 X 11.5 M
HSB06-181810	CUI Devices	780	HEAT SINK, BGA, 18 X 18 X 10 MM
HSB07-202009	CUI Devices	35,000	HEAT SINK, BGA, 20 X 20 X 9 MM
HSB08-212106	CUI Devices	35,000	HEAT SINK, BGA, 21 X 21 X 6 MM
HSB09-212115	CUI Devices	35,000	HEAT SINK, BGA, 21 X 21 X 15 MM