LTN20069

Mfr.Part #
LTN20069
Manufacturer
Wakefield Thermal
Package/Case
-
Datasheet
LTN20069
Description
HEAT SINK BGA/PGA 16.5X16.5X8.9
Stock
21362

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Manufacturer :
Wakefield Thermal
Product Category :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Square, Fins
Thermal Resistance @ Forced Air Flow :
8.00°C/W @ 500 LFM
Thermal Resistance @ Natural :
-
Type :
Board Level
Datasheets
LTN20069

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