1323XDSK-BDM

Mfr.Part #
1323XDSK-BDM
Manufacturer
NXP Semiconductors
Package/Case
-
Datasheet
1323XDSK-BDM
Description
RF EVAL FOR MC1323X
Stock
3

Request A Quote(RFQ)

* Contact Name:
  Company:
* E-Mail:
  Whatsapp:
  Comment:
Manufacturer :
NXP Semiconductors
Product Category :
Development Boards, Kits, Programmers > RF Evaluation and Development Kits, Boards
For Use With/Related Products :
MC1323x
Frequency :
2.4GHz
Product Status :
Active
Supplied Contents :
Board(s)
Type :
Transceiver; 802.15.4
Datasheets
1323XDSK-BDM

Manufacturer related products

Catalog related products

  • Digi
    XBEE THT GROVE DEV BOARD
  • Nordic Semiconductor
    DEV KIT FOR NRF51 SERIES
  • Nordic Semiconductor
    NORDIC THINGY:52 BLE DEV BOARD
  • Nordic Semiconductor
    NORDIC THINGY:53 BLE SENSOR BRD
  • Digi
    DIGI DEVELOPMENT BOARD - XBEE3,

Related products

Part Manufacturer Stock Description
1323 Keystone Electronics Corp. 35,000 TOOL INSERTION FOR SLDRLESS TERM
1323-2-AL RAF 35,000 HEX SPACERPLAIN ALUMINUM3/16 HEX
1323-2-B RAF 35,000 HEX SPACERPLAIN BRASS3/16 HEX X
1323-2-N RAF 35,000 HEX SPACERNO FINISH - NYLON3/16
1323-2-S RAF 35,000 HEX SPACERPLAIN STEEL3/16 HEX X
1323-2-SS RAF 35,000 HEX SPACERPLAIN STAINLESS STEEL3
1323-4-AL RAF 35,000 HEX SPACERPLAIN ALUMINUM3/16 HEX
1323-4-AL-9 RAF 35,000 HEX SPACERALODINE 1200HEX CLEAR
1323-4-B RAF 35,000 HEX SPACERPLAIN BRASS3/16 HEX X
1323-4-B-12 RAF 35,000 HEX SPACERCLEAR ZINCHEX CLEAR HO
1323-4-N RAF 35,000 HEX SPACERNO FINISH - NYLON3/16
1323-4-S RAF 35,000 HEX SPACERPLAIN STEEL3/16 HEX X
1323-4-SS RAF 35,000 HEX SPACERPLAIN STAINLESS STEEL3
1323.2 Conta-Clip 35,000 FEED-THROUGH TERMINAL FOR DIRECT
13230 Desco 9,815 BAG SHLD METAL-OUT ZIP 5X8