| ZSC31010CEB |
Renesas Electronics Corporation |
35,000 |
WAFER (UNSAWN) - BOX |
| ZSC31010CEC |
Renesas Electronics Corporation |
35,000 |
DICE (WAFER SAWN) - FRAME |
| ZSC31010CED |
Renesas Electronics Corporation |
35,000 |
DICE (WAFER SAWN) - WAFFLE PACK |
| ZSC31010CEG1-R |
Renesas Electronics Corporation |
35,000 |
IC INTERFACE SPECIALIZED 8SOIC |
| ZSC31010CEG1-T |
Renesas Electronics Corporation |
35,000 |
IC INTFACE SPECIALIZED SGNL COND |
| ZSC31010CIB |
Renesas Electronics Corporation |
35,000 |
WAFER (UNSAWN) - BOX |
| ZSC31010CIC |
Renesas Electronics Corporation |
35,000 |
DICE (WAFER SAWN) - FRAME |
| ZSC31010CIG1-R |
Renesas Electronics Corporation |
35,000 |
IC INTFACE SPECIALIZED SGNL COND |
| ZSC31010CIG1-T |
Renesas Electronics Corporation |
35,000 |
IC INTFACE SPECIALIZED SGNL COND |
| ZSC31010KITV2P1 |
Renesas Electronics Corporation |
35,000 |
ZSC31010KIT EVALUATION KIT V2.1 |
| ZSC31010MCREFBV1P0 |
Renesas Electronics Corporation |
35,000 |
ZSC31010 MASS CALIBR. REF. BOARD |
| ZSC31010MCSV1P1 |
Renesas Electronics Corporation |
35,000 |
ZSC31010 MASS CALIBRATION SYSTEM |
| ZSC31014BOARDV2P1S |
Renesas Electronics Corporation |
35,000 |
SSC BOARD ZSC31014 V2.1 WITH SAM |
| ZSC31014EAB |
Renesas Electronics Corporation |
35,000 |
WAFER (UNSAWN) - BOX |
| ZSC31014EAC |
Renesas Electronics Corporation |
35,000 |
DICE (WAFER SAWN) - FRAME |
