TS991SNL500T3

Mfr.Part #
TS991SNL500T3
Manufacturer
Chip Quik, Inc.
Package/Case
-
Datasheet
TS991SNL500T3
Description
SOLDER PASTE THERMALLY STABLE NC
Stock
20

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Manufacturer :
Chip Quik, Inc.
Product Category :
Soldering, Desoldering, Rework Products > Solder
Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter :
-
Flux Type :
No-Clean
Form :
Jar, 17.64 oz (500g)
Melting Point :
423°F (217°C)
Mesh Type :
3
Process :
Lead Free
Product Status :
Active
Shelf Life :
12 Months
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
-
Type :
Solder Paste
Wire Gauge :
-
Datasheets
TS991SNL500T3

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