WS991SNL500T4
- Mfr.Part #
- WS991SNL500T4
- Manufacturer
- Chip Quik, Inc.
- Package/Case
- -
- Datasheet
- WS991SNL500T4
- Description
- SOLDER PASTE THERMALLY STABLE WS
- Stock
- 35000
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- Manufacturer :
- Chip Quik, Inc.
- Product Category :
- Soldering, Desoldering, Rework Products > Solder
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 4
- Process :
- Lead Free
- Product Status :
- Active
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheets
- WS991SNL500T4
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|---|---|---|---|
| WS991 | Chip Quik, Inc. | 5 | TACKY FLUX WATER-SOLUBLE 10CC SY |
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| WS991-5M | Chip Quik, Inc. | 59 | WATER-SOLUBLE TACK FLUX W/TIPS |
| WS991AX35T4 | Chip Quik, Inc. | 9 | THERMALLY STABLE SOLDER PASTE WS |
| WS991AX500T4 | Chip Quik, Inc. | 3 | SOLDER PASTE THERMALLY STABLE WS |
| WS991LT35T4 | Chip Quik, Inc. | 35,000 | THERMALLY STABLE SOLDER PASTE WS |
| WS991LT500T4 | Chip Quik, Inc. | 35,000 | SOLDER PASTE THERMALLY STABLE WS |
| WS991SNL35T4 | Chip Quik, Inc. | 2 | THERMALLY STABLE SOLDER PASTE WS |
