TS991SNL35T3
- Mfr.Part #
- TS991SNL35T3
- Manufacturer
- Chip Quik, Inc.
- Package/Case
- -
- Datasheet
- TS991SNL35T3
- Description
- THERMALLY STABLE SOLDER PASTE NC
- Stock
- 6
Request A Quote(RFQ)
- * Contact Name:
- Company:
- * E-Mail:
- Whatsapp:
- Comment:
- Manufacturer :
- Chip Quik, Inc.
- Product Category :
- Soldering, Desoldering, Rework Products > Solder
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 1.23 oz (34.869g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 3
- Process :
- -
- Product Status :
- Active
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheets
- TS991SNL35T3
Manufacturer related products
Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| TS991AX35T4 | Chip Quik, Inc. | 35,000 | THERMALLY STABLE SOLDER PASTE NC |
| TS991AX500T4 | Chip Quik, Inc. | 35,000 | SOLDER PASTE THERMALLY STABLE NC |
| TS991SNL35T4 | Chip Quik, Inc. | 35,000 | THERMALLY STABLE SOLDER PASTE NC |
| TS991SNL500T3 | Chip Quik, Inc. | 20 | SOLDER PASTE THERMALLY STABLE NC |
| TS991SNL500T4 | Chip Quik, Inc. | 17 | SOLDER PASTE THERMALLY STABLE NC |
