Thermal - Pads, Sheets
- Manufacturer:
-
- AMEC Thermasol (3)
- CUI Devices (39)
- Parker Chomerics (3)
- Shiu Li Technology (120)
- Backing, Carrier:
-
- Outline:
-
- Product Status:
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- Shape:
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- Thermal Conductivity:
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- Thermal Resistivity:
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- Type:
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- Usage:
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209 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
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Parker Chomerics | THERM PAD 28X28MM P... |
35,000
In-stock
|
Get Quote | ||
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Parker Chomerics | THERM PAD 152.4X152.4... |
802
In-stock
|
Get Quote | ||
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Bergquist / Henkel | THERM PAD 406.4MMX2... |
415
In-stock
|
Get Quote | ||
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Laird - Performance Materials | TFLEX SF860 |
52
In-stock
|
Get Quote | ||
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Bergquist / Henkel | BERGQUIST GAP PA... |
25
In-stock
|
Get Quote | ||
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Laird - Performance Materials | COOLZORB-ULTRA,0.... |
45
In-stock
|
Get Quote | ||
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Bergquist / Henkel | BERGQUIST GAP PA... |
4
In-stock
|
Get Quote | ||
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Laird - Performance Materials | TFLEX SF820 |
76
In-stock
|
Get Quote | ||
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Laird - Performance Materials | TFLEX SF830 |
54
In-stock
|
Get Quote | ||
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Laird - Performance Materials | TFLEX SF840 |
85
In-stock
|
Get Quote | ||
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Laird - Performance Materials | TFLEX SF8100 |
7
In-stock
|
Get Quote | ||
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Bergquist / Henkel | BERGQUIST GAP PA... |
3
In-stock
|
Get Quote | ||
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Bergquist / Henkel | BERGQUIST GAP PA... |
2
In-stock
|
Get Quote | ||
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Laird - Performance Materials | COOLZORB-ULTRA,0.... |
3
In-stock
|
Get Quote | ||
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CUI Devices | THERM PAD 15MMX30M... |
14
In-stock
|
Get Quote | ||
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CUI Devices | THERM PAD 20MMX20M... |
13
In-stock
|
Get Quote | ||
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CUI Devices | THERM PAD 10MMX10M... |
11
In-stock
|
Get Quote | ||
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CUI Devices | THERM PAD 50MMX50M... |
12
In-stock
|
Get Quote | ||
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CUI Devices | THERM PAD 40MMX40M... |
29
In-stock
|
Get Quote | ||
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CUI Devices | THERM PAD 41.25MMX4... |
7
In-stock
|
Get Quote |