Thermal - Heat Sinks
- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Filter：
173 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
19
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 6.5W... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
72
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.6W... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote |
