Thermal - Heat Sinks
- Attachment Method:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Shape:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Filter:
173 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, EXTRUS... |
3,230
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,542
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,582
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 37.... |
665
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,197
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,118
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 43.... |
1,081
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,572
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
992
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
999
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 60 ... |
223
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK TO-220 2.6W... |
545
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
605
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
960
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 18 ... |
780
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
646
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 35 ... |
700
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 27 ... |
239
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK TO-220 5.1W... |
712
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
703
In-stock
|
Get Quote |