Thermal - Heat Sinks
- Attachment Method：
-
- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Filter：
173 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
2,987
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,355
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,657
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,957
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1,358
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,577
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,713
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,870
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,500
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,992
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,215
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
4,828
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1,194
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,606
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,977
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1,704
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,577
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,740
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1,202
In-stock
|
Get Quote |
