Thermal - Heat Sinks
- Manufacturer:
-
- Aavid (1)
- CTS Corporation (229)
- CUI Devices (120)
- iWave Systems (3)
- Malico Inc. (21)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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596 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
ASSMANN WSW Components | HEATSINK CPU XCU... |
53,181
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
15,288
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU XCU... |
2,598
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU XCU... |
4,077
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 10 ... |
3,205
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU XCU... |
2,403
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU XCU... |
5,602
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 14 ... |
3,326
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU XCU... |
4,287
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 23 ... |
1,287
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 27 ... |
1,713
In-stock
|
Get Quote | |||
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,280
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
2,893
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 12 ... |
1,689
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 23 ... |
5,589
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU XCU... |
1,956
In-stock
|
Get Quote | |||
ASSMANN WSW Components | CPU HEATSINK, CRO... |
422
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
2,208
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1,944
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 25 ... |
1,433
In-stock
|
Get Quote |