Thermal - Heat Sinks
- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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2 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, BGA, 18 ... |
780
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | 1/8 BRICK HEATSINK... |
95
In-stock
|
Get Quote |