Thermal - Heat Sinks
- Manufacturer：
-
- CUI Devices (1)
- Malico Inc. (2)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote | ||
|
|
Malico Inc. | AL HEAT SINK 19X19X... |
35,000
In-stock
|
Get Quote | ||
|
|
Malico Inc. | AL HEAT SINK 21X21X... |
35,000
In-stock
|
Get Quote |
