Thermal - Heat Sinks
- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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2 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK TO-220 TO... |
6,335
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
646
In-stock
|
Get Quote |