Thermal - Heat Sinks
- Manufacturer:
-
- CUI Devices (1)
- Attachment Method:
-
- Material:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
2 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
149
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote |