Thermal - Heat Sinks
- Manufacturer：
-
- Aavid (1)
- CUI Devices (1)
- Ohmite (2)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Natural：
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20 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
31,979
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
4,538
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
143
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK DUAL FO... |
48
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK DUAL FO... |
33
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
100
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 21MM... |
9
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X24.5M... |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X24.5M... |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
3
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK |
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 21MM... |
35,000
In-stock
|
Get Quote |
