Thermal - Heat Sinks
- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, EXTRUS... |
14
In-stock
|
Get Quote | |||
Wakefield Thermal | HEAT SINK ELLIP F... |
35,000
In-stock
|
Get Quote |