Thermal - Heat Sinks
- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 5 FINS, 2.000 OD HS W... |
35,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 5 FINS, 2.000 OD HS W... |
35,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 5 FINS,2.000 OD HS W/... |
35,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 5 FINS,2.000 OD HS W/... |
35,000
In-stock
|
Get Quote |
