Thermal - Heat Sinks
- Manufacturer：
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- CUI Devices (14)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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15 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
2,893
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,944
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,262
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,870
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,215
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
4,828
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,606
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,977
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
646
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
35,000
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK FOR TO2... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
35,000
In-stock
|
Get Quote |
