Thermal - Heat Sinks
- Manufacturer：
-
- Molex (2)
- CTS Corporation (121)
- Enclustra (1)
- Panasonic (2)
- Sanyo Denki (20)
- Seeed (5)
- Sunon (3)
- T-Global Technology (38)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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215 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Delta Electronics | FAN CPU COOLER 90X... |
173
In-stock
|
Get Quote | ||
|
|
T-Global Technology | XL25 CERAMIC BOAR... |
735
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
67
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
51
In-stock
|
Get Quote | ||
|
|
T-Global Technology | XL25 CERAMIC BOAR... |
127
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
72
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
32
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
77
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
13
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
97
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
80
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
78
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
29
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | HTS665-2=HS PLTD |
5
In-stock
|
Get Quote | ||
|
|
Panasonic | HEAT SINK |
35,000
In-stock
|
Get Quote | ||
|
|
Panasonic | HEAT SINK |
35,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PRESS O... |
35,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PRESSON... |
35,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PRESSON... |
35,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | CLIP W/LOCK FOR H... |
35,000
In-stock
|
Get Quote |
