Thermal - Heat Sinks
- Manufacturer：
-
- Comair Rotron (2)
- CTS Corporation (36)
- Ohmite (3)
- Panasonic (1)
- Seeed (1)
- Wakefield Thermal (13)
- Attachment Method：
-
- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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114 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors | HTS389-P=HS ASSY PP... |
249
In-stock
|
Get Quote | ||
|
|
CTS Corporation | THERMAL LINK PRE... |
490
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
3
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | HTS665-2=HS PLTD |
5
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK W/CLIP -... |
35,000
In-stock
|
Get Quote | ||
|
|
Panasonic | HEAT SINK |
35,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | THERMAL LINK PRE... |
35,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK CAP .500"H... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 21MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
35,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PRESS O... |
35,000
In-stock
|
Get Quote |
