Thermal - Heat Sinks
- Manufacturer:
-
- Molex (2)
- ABB Embedded Power (15)
- Comair Rotron (49)
- CTS Corporation (165)
- Enclustra (1)
- Ohmite (6)
- Panasonic (2)
- Sanyo Denki (20)
- Seeed (5)
- Sunon (1)
- T-Global Technology (61)
- Wakefield Thermal (19)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Shape:
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- Thermal Resistance @ Forced Air Flow:
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377 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
TE Connectivity AMP Connectors | HTS389-P=HS ASSY PP... |
249
In-stock
|
Get Quote | |||
CTS Corporation | THERMAL LINK PRE... |
490
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 50.8X12.70X... |
298
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 10... |
937
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 10... |
347
In-stock
|
Get Quote | |||
T-Global Technology | XL25 CERAMIC BOAR... |
735
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
67
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
51
In-stock
|
Get Quote | |||
T-Global Technology | XL25 CERAMIC BOAR... |
127
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
72
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
32
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
77
In-stock
|
Get Quote | |||
Ohmite | HEATSINK UNIVERS... |
33
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
25
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
3
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
13
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
97
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
80
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
78
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
29
In-stock
|
Get Quote |