Thermal - Heat Sinks
- Manufacturer:
-
- Comair Rotron (3)
- Sanyo Denki (5)
- Seeed (2)
- T-Global Technology (18)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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32 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
T-Global Technology | PH3N NANO 50.8X12.70X... |
298
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 101.6X38.1X... |
9
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK CLIP-ON... |
35,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 12-SIP W/... |
35,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK DPAK SM... |
35,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 10... |
35,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 10... |
35,000
In-stock
|
Get Quote | |||
Comair Rotron | HEATSINK STAMP 20... |
35,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK ALUM AN... |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3 50.8X12.07X0.21MM |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3 76.2X12.07X0.21MM |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3 76.2X25.4X0.21MM |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3 101.6X25.4X0.21MM |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3 101.6X38.1X0.21MM |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 50.8X12.07X... |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X12.07X... |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X19.1X0... |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 101.6X25.4X... |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X12.07X... |
35,000
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X19.1X0... |
35,000
In-stock
|
Get Quote |