Thermal - Heat Sinks
- Manufacturer：
-
- Brainboxes (1)
- DFRobot (1)
- Seeed (2)
- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
OSEPP Electronics | RASPBERRY PI LOW... |
605
In-stock
|
Get Quote | ||
|
|
OSEPP Electronics | RASPBERRY PI TAL... |
565
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
22
In-stock
|
Get Quote | ||
|
|
DFRobot | RASPBERRY PI COP... |
35,000
In-stock
|
Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
1
In-stock
|
Get Quote | ||
|
|
Brainboxes | RASPBERRY PI COM... |
24
In-stock
|
Get Quote |
