23-60FS-NI-24

制造商零件号
23-60FS-NI-24
制造商
Leader Tech Inc.
包装/案例
-
数据表
23-60FS-NI-24
描述
0.23 X 0.60 NI 24--FOLDED SERIES
库存
35000

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制造商 :
Leader Tech Inc.
产品分类 :
射频/中频和射频识别 > RFI 和 EMI - 触点、指杆和垫圈
Attachment Method :
Adhesive
Material :
Beryllium Copper
Operating Temperature :
-55°C ~ 121°C
Plating :
Nickel
Plating - Thickness :
Flash
Product Status :
Active
Shape :
-
Type :
Fingerstock
数据列表
23-60FS-NI-24

制造商相关产品

目录相关产品

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    SPRING FINGER 1.2H
  • Harwin
    RFI SHIELD CLIP MINI TIN SMD
  • Harwin
    SMT RFI CLIP 1900/TR (T&R)
  • Harwin
    RFI SHIELD CLIP MICRO TIN SMD
  • TE Connectivity AMP Connectors
    PRE-LOADED SPRING FINGER 2.15MM

相关产品

部分 制造商 库存 描述
23-6040-0018 Kester 35,000 SOLDER RA FLUX 22AWG 60/40 .5LB
23-6040-0027 Kester 35,000 SOLDER RA FLUX 20AWG 60/40 .5LB
23-60FS-BD-24 Leader Tech Inc. 35,000 0.23 X 0.60 BD 24--FOLDED SERIES
23-60FS-BD-24-NTP Leader Tech Inc. 35,000 0.23 X 0.60 BD 24 NTP--FOLDED SE
23-60FS-BD-3.0 Leader Tech Inc. 35,000 0.23 X 0.60 BD 3--FOLDED SERIES
23-60FS-BD-400 Leader Tech Inc. 35,000 0.23 X 0.60 BD 400--FOLDED SERIE
23-60FS-MAG-24 Leader Tech Inc. 35,000 0.23 X 0.60 MAG 24--FOLDED SERIE
23-60FS-SN-16 Leader Tech Inc. 35,000 0.23 X 0.60 SN 16--FOLDED SERIES
23-60FS-SN-24 Leader Tech Inc. 35,000 0.23 X 0.60 SN 24--FOLDED SERIES
23-60FS-SNPB-24 Leader Tech Inc. 35,000 0.23 X 0.60 SNPB 24--FOLDED SERI
23-60FSV50-BD-24 Leader Tech Inc. 35,000 0.23 X 0.60 BD 24--FOLDED SERIES
23-60FSV50-SN-24 Leader Tech Inc. 35,000 0.23 X 0.60 SN 24--FOLDED SERIES
23-6337-0007 Kester 35,000 SOLDER RA FLUX 27AWG 63/37 .5LB
23-6337-0018 Kester 35,000 SOLDER RA FLUX 22AWG 63/37 .5LB
23-6337-0027 Kester 35,000 SOLDER RA FLUX 20AWG 63/37 .5LB