BGF 104C E6327
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- 制造商 :
- Infineon Technologies
- 产品分类 :
- 集成电路 (IC) > 专用集成电路
- Applications :
- HSMMC (High Speed Multi Media Card)
- Mounting Type :
- Surface Mount
- Package / Case :
- 16-WFBGA, WLCSP
- Product Status :
- Obsolete
- Supplier Device Package :
- WLP-16-1
- Type :
- Filter, HSMMC with ESD Protection
- 数据列表
- BGF 104C E6327
制造商相关产品
目录相关产品
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| 部分 | 制造商 | 库存 | 描述 |
|---|---|---|---|
| BGF 100 E6327 | Infineon Technologies | 35,000 | IC VOLUME CONTROL S-WLP-11 |
| BGF 108L E6328 | Infineon Technologies | 35,000 | FILTER LC 28PF (TOTAL) ESD SMD |
| BGF 109L E6328 | Infineon Technologies | 35,000 | FILTER LC 28PF (TOTAL) ESD SMD |
| BGF 200 E6327 | Infineon Technologies | 35,000 | IC VOLUME CONTROL S-WLP-8 |
| BGF-46166-18-4-003 | BDNC (Holding) Limited | 80 | SPEAKER FLAT GLASS 166X46X17MM |
| BGF.0M.100.XAV | LEMO | 35,000 | CONN BLANKING COVER SILVER |
| BGF.0M.200.XAZ | LEMO | 35,000 | CONN BLANKING COVER |
| BGF.1M.100.XAV | LEMO | 13 | CONN BLANKING COVER SILVER |
| BGF.1M.200.XAZ | LEMO | 35,000 | CONN BLANKING COVER |
| BGF.2M.100.XAV | LEMO | 35,000 | CONN BLANKING COVER SILVER |
| BGF.2M.200.XAZ | LEMO | 35,000 | CONN BLANKING COVER |
| BGF.3M.100.XAV | LEMO | 35,000 | CONN BLANKING COVER |
| BGF.4M.100.XAV | LEMO | 35,000 | CONN BLANKING COVER |
| BGF.5M.100.XAV | LEMO | 35,000 | CONN BLANKING COVER |
| BGF.LM.100.XAV | LEMO | 35,000 | CONN BLANKING COVER |
