Shenzhen HYST Technology Co., Ltd.
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  5. HSE-B18381-035H-02
    图片仅供参考。

    HSE-B18381-035H-02

    制造商零件号
    HSE-B18381-035H-02
    制造商
    CUI Devices
    包装/案例
    -
    数据表
    HSE-B18381-035H-02
    描述
    HEAT SINK, EXTRUSION, TO-218, 38
    库存
    35000

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    制造商 :
    CUI Devices
    产品分类 :
    风扇，热管理 > 热 - 散热器
    Attachment Method :
    Clip and PC Pin
    Diameter :
    -
    Material :
    Aluminum Alloy
    Material Finish :
    Black Anodized
    Package Cooled :
    TO-218
    Power Dissipation @ Temperature Rise :
    12.0W @ 75°C
    Product Status :
    Active
    Shape :
    Rectangular, Angled Fins
    Thermal Resistance @ Forced Air Flow :
    3.79°C/W @ 200 LFM
    Thermal Resistance @ Natural :
    6.25°C/W
    Type :
    Board Level, Vertical
    数据列表
    HSE-B18381-035H-02

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    HSE-B18318-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION,TO-218, 31.
    HSE-B18381-035H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
    HSE-B18381-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
    HSE-B18381-060H-W CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
    HSE-B18508-035H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50
    HSE-B18508-035H-03 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50
    HSE-B18508-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50
    联系我们
    • 电子邮件: [email protected]
    • 电话: +8618025490234
    • 地址: Address:Rm 3203 32/F SEG Plaza, No.1002 Huaqiang North Road, Futian District Shenzhen GD CHINA
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