HSS21-B20-P53
- 制造商零件号
- HSS21-B20-P53
- 制造商
- CUI Devices
- 包装/案例
- -
- 数据表
- HSS21-B20-P53
- 描述
- HEAT SINK, STAMPING, TO-218/TO-2
- 库存
- 35000
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- * 联系人姓名:
- 公司:
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- 电话:
- 评论:
- 制造商 :
- CUI Devices
- 产品分类 :
- 风扇,热管理 > 热 - 散热器
- Attachment Method :
- PC Pin
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-218, TO-220
- Power Dissipation @ Temperature Rise :
- 3.58W @ 75°C
- Product Status :
- Active
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 10.10°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 20.93°C/W
- Type :
- Board Level
- 数据列表
- HSS21-B20-P53
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