HSE-B18508-035H

制造商零件号
HSE-B18508-035H
制造商
CUI Devices
包装/案例
-
数据表
HSE-B18508-035H
描述
HEAT SINK, EXTRUSION, TO-218, 50
库存
35000

请求报价(RFQ)

* 联系人姓名:
  公司:
* 电子邮件:
  电话:
  评论:
制造商 :
CUI Devices
产品分类 :
风扇,热管理 > 热 - 散热器
Attachment Method :
Bolt On and PC Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218
Power Dissipation @ Temperature Rise :
12.8W @ 75°C
Product Status :
Active
Shape :
Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow :
2.98°C/W @ 200 LFM
Thermal Resistance @ Natural :
5.86°C/W
Type :
Board Level, Vertical
数据列表
HSE-B18508-035H

制造商相关产品

目录相关产品

相关产品

部分 制造商 库存 描述
HSE-B1711-032 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-220, 25
HSE-B1711-057 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-220, 25
HSE-B18254-035H CUI Devices 610 HEAT SINK, EXTRUSION, TO-218, 25
HSE-B18254-035H-00 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 25
HSE-B18254-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION,TO-218, 25.
HSE-B18254-060H-W CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 25
HSE-B18317-035H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 31
HSE-B18317-035H-01 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 31
HSE-B18318-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION,TO-218, 31.
HSE-B18381-035H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
HSE-B18381-035H-02 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
HSE-B18381-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
HSE-B18381-060H-W CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
HSE-B18508-035H-03 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50
HSE-B18508-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50