BM57B0.6-10DP/2-0.3V(53)
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- 制造商 :
- Hirose
- 产品分类 :
- 矩形连接器 > 阵列，边缘类型，夹层（板对板）
- Connector Type :
- Header, Outer Shroud Contacts
- Contact Finish :
- Gold
- Contact Finish Thickness :
- 1.97µin (0.050µm)
- Features :
- Solder Retention
- Mated Stacking Heights :
- 0.6mm
- Mounting Type :
- Surface Mount
- Number of Positions :
- 10
- Number of Rows :
- 2
- Product Status :
- Active
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| 部分 | 制造商 | 库存 | 描述 |
|---|---|---|---|
| BM57B0.6-10DP/2-0.3V(51) | Hirose | 35,000 | CONN HDR 0.3MM SMD 10POS + 2PWR |
| BM57B0.6-10DS/2-0.3V(51) | Hirose | 35,000 | CONN RCPT 0.3MM SMD 10POS + 2PWR |
| BM57B0.6-10DS/2-0.3V(53) | Hirose | 35,000 | CONN RCPT 0.3MM SMD 10POS + 2PWR |
| BM57SPP03MC2-000401 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP03MC2-000501 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05MC2-000101 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05MC2-000401 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05MC2-AD0201 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05NC2-0001AA | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPPS3MC2-000301 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPPS5MC2-000301 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPPS5MC2-000401 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
