热 - 散热器
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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2 条记录
图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK TO-220 TO... |
6,335
In-stock
|
提交询价 | |||
CUI Devices | HEAT SINK, STAMPI... |
646
In-stock
|
提交询价 |