热 - 散热器
- 品牌：
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- Molex (2)
- Aavid (1)
- ABB Embedded Power (15)
- Comair Rotron (49)
- CTS Corporation (219)
- CUI Devices (3)
- Enclustra (1)
- Ohmite (17)
- Panasonic (2)
- Sanyo Denki (20)
- Seeed (5)
- Sunon (3)
- T-Global Technology (61)
- Wakefield Thermal (31)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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545 条记录
| 图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
|---|---|---|---|---|---|---|
|
Delta Electronics | FAN CPU COOLER 90X... |
173
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HTS389-P=HS ASSY PP... |
249
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 25MM... |
232
In-stock
|
提交询价 | ||
|
|
CTS Corporation | THERMAL LINK PRE... |
490
In-stock
|
提交询价 | ||
|
|
T-Global Technology | PH3N NANO 50.8X12.70X... |
298
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
937
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 10... |
347
In-stock
|
提交询价 | ||
|
|
T-Global Technology | XL25 CERAMIC BOAR... |
735
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
67
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
51
In-stock
|
提交询价 | ||
|
|
T-Global Technology | XL25 CERAMIC BOAR... |
127
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK FOR STU... |
219
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
72
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
32
In-stock
|
提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
77
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK TO-5 1W H... |
557
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK DUAL FO... |
48
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK DUAL FO... |
33
In-stock
|
提交询价 | ||
|
|
Ohmite | HEATSINK UNIVERS... |
33
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
25
In-stock
|
提交询价 |
