热 - 散热器

Attachment Method:
Package Cooled:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
图片 型号 品牌 描述 库存 操作
HSS-B20-NP-12 CUI Devices
HEATSINK TO-220 6.8W...
RFQ
1,393
In-stock
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HSB19-272718 CUI Devices
HEAT SINK, BGA, 27 ...
RFQ
239
In-stock
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